Hologram IoT SIM Datasheet

This article will provide an overview of hardware specifications for Hologram IoT SIMs and software specifications applicable to those SIMs.

Hardware Features

CHIP TYPE	INDUSTRIAL GRADE	STANDARD GRADE
Supplier	Starchip	Samsung
Chip Codes	SCM392G	S3FS9FG
Electrical Characteristics	1.6V to 5.5V	1.6V, 3V and 5V
Operational Temperature Characteristics	-40o to 105°C	-25o to 85°C
Memory Size available for program and data	136K/256K	340K/440K

NVRAM CHARACTERISTICS	INDUSTRIAL GRADE	STANDARD GRADE
Endurance cycles (min) @ 25°	Min. 200MM read/write cycle	Min. 500K read/write cycle
Data retention (min) @ 25°	25 Years	25 Years
Vibration	Passes JESD22-B103
Sector/Bank erase time	1.5ms/3ms	1.5ms/3ms
Page write/erase time	1.5ms/0.4ms	1.5ms/0.4ms

Software Features

PLATFORM	INDUSTRIAL GRADE	STANDARD GRADE
Technology	2G/3G/4G/LTE	2G/3G/4G/LTE
UICC	Release 8	Release 8
Java Card	2.2.1 or higher	2.2.1 or higher
Global Platform	2.2.1	2.2.1

SUPPORTED APPLICATIONS	INDUSTRIAL GRADE	STANDARD GRADE
SIM	Release 4	Release 4
USIM	Release 8	Release 8
ISIM	Release 8	Release 8
HPSIM	Release 8

SIM Card Physical Characteristics

Embedded Form Factor (MFF2)


Module Format	2FF/3FF/4FF or MFF2 (QFN8) embedded.
Size (for MFF2)	For MFF2: 6 x 5mm*, (height: 0.75-0.82mm)
Standard	TS 102.671 - standardized format
Fitting	Soldered to circuit board
Transportation	On trays/reels/boxes

Technical Details (MFF2)

Embedded Dimensions

SIM Card Physical Characteristics

SIM Card Physical Characteristics

Download Hologram IoT SIM Datasheet as PDF.