Hologram provides a number of IoT SIM specifications to meet your deployment and specific hardware needs. An overview of hardware specifications for our IoT SIMs and software specifications applicable to those SIMs can be found below. Our SIMs are available for purchase in both triple cut card and MFF2 embedded SIM (eSIM) form factors.
A global IoT SIM for every use case
SIM card specifications
Global SIM — Triple Cut — Standard Grade
Triple cut form factor
- Mini (2FF): 25mm × 15mm × 0.71 mm
- Micro (3FF): 15mm × 12mm × 0.71 mm
- Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating characteristics
- Electrical: 1.6V, 3V, and 5V
- Operational temperature: −25°C to +85°C
- Memory (NVM): 340 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Global SIM — Triple Cut — Industrial Grade
Triple cut form factor
- Mini (2FF): 25mm × 15mm × 0.71 mm
- Micro (3FF): 15mm × 12mm × 0.71 mm
- Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating Characteristics
- Electrical: 1.62V to 5.5V
- Operational temperature: −40°C to +105°C
- Memory (NVM): 704 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Global SIM — Embedded — Standard Grade
Embedded Chip Format
- MFF2 (QNF8): 6 × 5 × 0.82 mm
Operating Characteristics
- Electrical: 1.6V, 3V, and 5V
- Operational Temperature: −40°C to +105°C
- Memory (NVM): 340 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Canada SIM — Triple Cut — Standard Grade
Triple cut form factor
- Mini (2FF): 25mm × 15mm × 0.71 mm
- Micro (3FF): 15mm × 12mm × 0.71 mm
- Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating characteristics
- Electrical: 1.62V to 5.5V
- Operational Temperature: −25ºC to +85ºC
- Memory (NVM): 704 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Looking for additional SIM types?
We have additional SIM types that are available to contracted customers. To request a datasheet or more information, please contact our sales team.