Hologram provides a number of IoT SIM specifications to meet your deployment and specific hardware needs. An overview of hardware specifications for our IoT SIMs and software specifications applicable to those SIMs can be found below. Our SIMs are available for purchase in both triple cut card and MFF2 embedded SIM (eSIM) form factors.
A global IoT SIM for every use case
Hologram's Hyper SIMs are industrial grade eUICC SIMs available in triple cut micro/mini/nano (2FF/3FF/4FF), and embedded SIM (eSIM, MFF2 DFN8) formats.
Industrial grade SIMs support any use case, and are ruggedized for extreme situations such as wide temperature operating ranges and extended life-cycle applications. For more information, see our SIM card page.
SIM card specifications
Hyper SIM — Triple Cut
Triple cut format
- Mini (2FF): 25mm × 15mm × 0.71 mm
- Micro (3FF): 15mm × 12mm × 0.71 mm
- Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating characteristics
- Electrical: 1.62V to 5V
- Operational temperature: −40°C to +105°C
- Memory (NVM): 800 KB
- Radio Access Technologies: 5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Common SKUs: G3, G3-G2-F, G2-F, US2+-G2-F. Formerly labeled Dual-Core and Dual-Core Capable SIMs.
Hyper SIM — Embedded SIM
Embedded SIM (eSIM) Format
- MFF2 (DFN8): 6 × 5 × 0.82 mm
Operating Characteristics
- Electrical: 1.62V to 5.5V
- Operational Temperature: −40°C to +105°C
- Memory (NVM): 330 KB
- Radio Access Technologies: 5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Previously available Hologram SIMs
Hologram's Global G1 and Canada G2 eUICC SIMs are no longer manufactured, but were available in standard and industrial grade for triple cut micro/mini/nano (2FF/3FF/4FF), and in standard grade embedded SIM (eSIM, MFF2 DFN8) formats. Standard SIMs are adequate for most use cases.
Global SIM — Triple Cut — Standard Grade
Triple cut format
- Mini (2FF): 25mm × 15mm × 0.71 mm
- Micro (3FF): 15mm × 12mm × 0.71 mm
- Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating characteristics – Standard Grade
- Electrical: 1.6V, 3V, and 5V
- Operational temperature: −25°C to +85°C
- Memory (NVM): 340 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Operating Characteristics – Industrial Grade
- Electrical: 1.62V to 5.5V
- Operational temperature: −40°C to +105°C
- Memory (NVM): 704 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Global SIM — Embedded — Standard Grade
Embedded SIM (eSIM) format
- MFF2 (DFN8): 6 × 5 × 0.82 mm
Operating Characteristics
- Electrical: 1.6V, 3V, and 5V
- Operational Temperature: −25°C to +85°C
- Memory (NVM): 340 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Canada SIM — Triple Cut — Standard Grade
Triple cut format
- Mini (2FF): 25mm × 15mm × 0.71 mm
- Micro (3FF): 15mm × 12mm × 0.71 mm
- Nano (4FF): 12.3mm × 8.8mm × 0.71 mm
Operating characteristics
- Electrical: 1.62V to 5.5V
- Operational Temperature: −25°C to +85°C
- Memory (NVM): 704 KB
- Radio Access Technologies: 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Looking for additional SIM types?
We have additional SIM types that are available to contracted customers. To request a datasheet or more information, please contact our sales team.